Polymatech signs MoU with Japanese manufacturer for tech transfer, training

Chennai-based Polymatech Electronics has signed a memorandum of understanding (MoU) with Japanese company Orbray. Under the agreement, the Japanese precision components manufacturer will supply Sapphire Ingot growing technologies and train electronics engineers at Polymatech at their facility in Japan. 

"This is a historic day for us as we move closer to our company's vision of becoming a 'Fully integrated – End-to-End - Semiconductor Company'. This MoU will enable us to progress towards converting Ingot into products, thereby entering the next level of our growth story,” said Eswara Rao Nandam, Managing Director & CEO of Polymatech Electronics.

Additionally, Polymatech which produces and packages opto-semiconductor chips, also plans on establishing its wafers fabricated ion in the Polymatech facility which will be primarily used for captive consumption. Polymatech electronics surplus capacity will be catered to companies entering the Indian market for packaging and other ATMP and OSAT units that may require sapphire wafers and bare dies. Notably, in February, the Union Cabinet approved the establishment of three new semiconductor units. To be built at a cumulative investment of ₹1.26 lakh crore (or over $15 billion), all three units are slated to start construction in the next 100 days. 

Polymatech’s current production capacity is 2,000 million chips which are produced at the company’s Oragadam, Tamil Nadu facility. Sharing the company's future plans, Eswara Rao Nandam added, "This is a considerable investment, and we will apply with the Government of India for capital subsidy under applicable schemes and respective state governments.”

Nandam also added that the company is in advanced discussion with silicon carbide wafer and silicon wafer fabrication machinery suppliers to accelerate plans to become multi-wafer producers.