It’s a wrap: News this week (May 10 – May 16)

There have been multiple developments this week on the tech front. From digital transformation deals to approval for a new semicon unit, here is a list of the most important updates for a quick catch-up:

Wipro grabs deal from UK publishing firm

Wipro has been selected by the UK-based leading publishing group, Hachette UK, to modernise its IT infrastructure. Under this partnership, Wipro will help in the implementation of the SAP S/4HANA system that will allow HUK to transform its finance operations and core enterprise applications, providing increased agility and speed and significantly enhancing source-to-pay operations.

“Adopting SAP S/4HANA signifies an important step in our digital transformation efforts, as it will help us enhance operational efficiency and provide us with the ability to adapt to changing market conditions quickly,” said Brendan Goss, Group CIO, Hachette UK & Hachette Book Group USA.

Infosys extends pact with Norway's DNB Bank

Infosys on Thursday expanded its strategic collaboration with DNB Bank ASA, Norway's largest bank, to accelerate the bank's digital transformation. The partnership will leverage the Infosys Finacle platform and next-generation technologies to modernise DNB's IT infrastructure, enhance customer experience, and optimise operational efficiency.

The company has been in a decade-long partnership with the Norwegian bank. The collaboration now focuses on improving IT resilience, modernising legacy systems, and delivering personalised lending solutions. Infosys will implement Artificial Intelligence and Machine Learning technologies to enable seamless, personalised banking services while proactively mitigating risks and minimising disruptions. 

LTIMindtree bags its largest ever AI deal

LTIMindtree recently secured its largest-ever contract — a $450 million, seven-year agreement with an unnamed global agribusiness player — to deliver AI-driven application, infrastructure, and cybersecurity services, marking a key shift in the company’s transformation strategy amid challenging times for the broader IT sector. The deal comes at a time when India’s $283 billion IT industry is grappling with macroeconomic uncertainty and rigid global tariff challenges.

While the company chose not to disclose the client’s identity, it confirmed that the engagement would involve application management, infrastructure support, and cybersecurity services, all delivered through an AI-driven operating model. The initiative will be powered by platforms such as SAP S/4HANA, Microsoft Azure, ServiceNow, and LTIMindtree's proprietary AI frameworks.

TCS partners with Khan Bank

Tata Consultancy Services (TCS) has formed a new partnership with Khan Bank, one of Mongolia’s largest commercial banks, to upgrade its digital banking infrastructure. This move is part of Khan Bank’s plan to modernise operations and expand digital services. 

The collaboration will use TCS’ BaNCS Global Banking Platform, a core banking solution designed to support a range of financial services. With this upgrade, Khan Bank aims to improve operational efficiency, support international payments, and deliver new banking products faster. 

HCL-Foxconn semicon unit gets approval

The Union Cabinet this week approved the HCL and Foxconn joint venture to set up the country’s sixth semiconductor unit. It will be built with an outlay of ₹3,700 crore, and is expected to create 2,000 jobs. IT Minister Ashwini Vaishnaw said that the HCL-Foxconn JV will set up the semiconductor plant near the upcoming Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) region in Uttar Pradesh.

The facility will have a capacity of 20,000 wafers per month and produce 36 million display driver chips monthly.