TCS launches chiplet-based system engineering services

Tapping into the $50 billion Indian semiconductor market, IT services firm TCS has announced the launch of its Chiplet-based System Engineering Services. This new offering provides semiconductor design services to accelerate innovation beyond traditional design, TCS said.

TCS will be using chiplets or small integrated circuits that serve as the building blocks of larger chips, to help deliver faster and more powerful processors. TCS’ new services are expected to give both Indian and international companies access to world-class expertise in chip-to-system engineering.

The company is offering the design and verification of industry standards such as Universal Chiplet Interconnect Express (UCle) and High Bandwidth Memory (HBM). The Mumbai-headquartered company also provides advanced package design services, including 2.5D and 3D interposers and multi-layer organic substrates – the materials that connect and support multi-chip packages.

TCS enables semiconductor clients to deliver next-generation multi-chip products with superior signal integrity, lower latency, and compact form factor. TCS has created a portfolio of chip-to-system engineering services, and the addition of Chiplet-based System Engineering services is aimed at democratising the design of next-generation chips for customers.

In a recent project, TCS partnered with a leading North American semiconductor firm to simplify the process of combining different types of chips into one system, addressing the complexities of heterogeneous device integration.

“TCS Chiplet-based System Engineering services will help semiconductor enterprises accelerate chiplets tapeout, driving flexibility, scalability, and faster time to market. Our extensive investments in next-gen technologies, contextual knowledge of the semiconductor industry, and strong track record in execution make us the preferred partner to drive innovation at scale,” said V Rajanna, President, Technology, Software and Services, TCS.