Tessolve partners with eSync Alliance to advance connected vehicle software standards

Tessolve, a semiconductor and product engineering company, has joined the eSync Alliance, a non-profit organization focused on standardizing Over-the-Air (OTA) software updates and data management for the automotive industry.

The collaboration aims to strengthen Tessolve’s connected vehicle portfolio, including its Edge HPC gateway (TERA), telematics control unit (TCU) cluster, and onboard diagnostic systems used by original equipment manufacturers (OEMs) and Tier-1 suppliers.

Through this partnership, Tessolve will align its engineering capabilities with eSync’s standardized framework to enable interoperable and compliant solutions for connected and software-defined vehicles. The joint effort is expected to help automakers and suppliers reduce time-to-market and maintain compliance with evolving cybersecurity and regulatory standards.

Tessolve’s expertise in embedded systems, post-silicon validation, and hardware design complements eSync’s three-tier server-client-agent architecture. This integration supports efficient OTA updates and diagnostics across vehicle layers—from electronic control units (ECUs) and sensors to cloud services.

“By integrating Tessolve’s embedded systems engineering capabilities with our TERA Edge HPC gateway, cluster, and diagnostic platforms, as well as secure connectivity solutions, we aim to accelerate the deployment of scalable, future-ready architectures for intelligent mobility." said Srini Chinamilli, Co-founder & CEO, Tessolve. 

“The eSync Alliance aims to facilitate the creation of secure, standardized data pipelines that are seamlessly connected to every aspect of the connected vehicle ecosystem from ECUs and sensors to the cloud. Tessolve’s end-to-end expertise in embedded systems- product engineering, post-silicon validation, custom silicon, chiplets and hardware design, cybersecurity and other areas helps us accelerate this vision,” says Mike Gardner, Executive Director, eSync Alliance.