HCLTech partners with French semiconductor firm to develop energy efficient chips

HCLTech has partnered with Dolphin Semiconductor, a firm specialising in low-power semiconductor IP, to co-develop energy-efficient chips. This partnership will help enterprises address growing demands for energy efficiency and high performance in increasingly complex and connected environments, especially in the data centre and IoT technologies. 

Leveraging its expertise in system-on-chip (SoC) architecture, design, and development, HCLTech will embed Dolphin’s specialized low-power IP into its silicon design workflows. This integration will deliver scalable, high-efficiency SoCs that reduce energy consumption while maintaining robust computational capabilities across diverse workloads.

“By partnering with HCLTech, we will be able to extend the reach of our low-power IP to more applications and customers than ever before. This partnership will help us push the boundaries of energy-efficient computing — whether it is for IoT devices or datacenter ecosystems,” said Pierre-Marie Dell’Accio, Executive VP Engineering of France-based Dolphin Semiconductor.
 
“As AI workloads surge, data grows exponentially, and sustainability becomes a top priority, our collaboration with Dolphin Semiconductor will empower our clients to lead with agility, high performance, and a strong commitment to environmental responsibility,” said Hari Sadarahalli, CVP and Head of Engineering and R&D Services, HCLTech.

HCLTech has been making several efforts to further its semiconductor business. HCLTech was selected in March as a Design Solution Partner (DSP) under the Samsung Advanced Foundry Ecosystem (SAFE) program. Under the SAFE-DSP program, HCLTech will provide application-specific integrated circuit (ASIC) design services to customers using Samsung’s semiconductor manufacturing processes. The collaboration will support efficient chip design and development. 

In 2024, HCLTech expanded its collaboration with Intel Foundry to co-develop customized silicon solutions for semiconductor manufacturers, system Original Equipment Manufacturers (OEMs), and cloud services providers to enhance foundry services.

Additionally, a semiconductor fab to be developed by the joint venture between HCLTech’s parent HCL Group and Taiwan's Foxconn, costing $435 million, was approved under the Indian Semiconductor Mission this year. The plant, which will be located near the Jewar airport in Uttar Pradesh, is designed for a capacity of 20,000 wafers per month and can produce 36 million display driver chips.