It’s a wrap: News this week (June 21 – 27)

There have been multiple developments this week on the tech front. From LTTS’ deal win to Ericsson’s new chip design unit in India, here is a list of the most important updates for a quick catch-up:

LTTS grabs $50mn deal

L&T Technologies Services (LTTS) has been selected by a global energy company as its engineering partner for enterprise data and digital services. The IT services firm has been awarded a five-year agreement valued at $50 million. LTTS already has a decade-long partnership with the said client.

The deal has been finalised as a long-term framework agreement, with LTTS assuming greater responsibility in delivering high-performance, reliable, and quality-driven digital services, the company said.

This week, LTTS also opened a new Engineering Design Center in Plano, Texas, marking an expansion of its operations in the US. The facility is aimed at supporting the development of advanced technologies in Artificial Intelligence (AI), digital manufacturing, and defence systems.

The centre, which complies with International Traffic in Arms Regulations (ITAR) regulations, has been designed to handle sensitive defence-related projects, including the design, development and testing of specialised products. It will also serve as a base for developing cybersecurity solutions and smart city technologies, featuring a dedicated Security Operations Center.

HCLTech, AMD join hands to advance AI and cloud technologies

HCLTech, one of India’s top IT services firms, has announced an alliance with chip maker AMD. The collaboration aims to speed up digital transformation for enterprises worldwide, focusing on artificial intelligence, cloud computing, and digital solutions.

The partnership will involve joint investment in innovation labs and training programmes. These efforts are expected to produce enterprise tools that can help businesses improve efficiency and explore new opportunities. Development centres set up under the alliance will test advanced technologies and accelerate the rollout of new products. Training and reskilling will also be part of the collaboration, helping companies prepare for rapid changes in the digital world.

Ericsson to begin R&D in India with new chip design unit

Ericsson is expanding its research and development (R&D) operations in India with a new focus on semiconductor development. The company will establish a unit for Application-Specific Integrated Circuit (ASIC) design in Bengaluru and plans to add over 150 engineers to support the initiative. 

This expansion marks a shift toward local development of specialised chips used in telecommunications infrastructure. ASICs are custom-designed semiconductors that improve the performance and efficiency of network equipment. Ericsson uses them across its mobile network systems, including radios, basebands, and transport equipment, the company said. 

The Bengaluru unit will be integrated into Ericsson’s global R&D structure and focus on tasks such as chip design, verification, and integration. The company already operates in India, and this move increases its investment in local technical capacity.